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自動化解決方案

惰性氣體充填設備 N2 / XCDA

Features

  • FOUP / RSP Purge

  • Standalone & Embedded purge

  • EAP control by SECS/HSMS

  • Humidity & O2 concentration Report

  • Recipe Control ( time , flow ,Humidity and O2 concentration)

  • E84 Communication

  • RFID reader

廠區內實際應用

Performance Data

OHB Continue Purge

Features

  • Clean purge

  • Central / local DB control

  • Integrated in OHB (no pass line change)

  • No OHB operation change

  • Humidity detection

  • Reflection mirror ,no E84

  • No MCS S/W modification

  • Continue purge

  • OHB stage ID

  • No RFID

  • Maximum 20 Stage monitor GUI

  • Control by PLC & DB

  • Use is OHB type ,shelf ,rack continue XCDA /N2 purge

Performance Data

Rack & STK Shelf Purge

FSTK Shelf Purge Architecture